BGA Reballing Stencils, Universal BGA Stencils with Fast Tin Implantation, Stainless Steel Reballing Stencils Templates 0.3 0.35 0.4 0.5 for Cellphones LitKiwi 54 meters / 5 ft

54 meters / 5 ft

and various other critical components

making every cut clean and consistent

5 mm) thick

BGA Reballing Stencils, Universal BGA Stencils with Fast Tin Implantation, Stainless Steel Reballing Stencils Templates 0.3 0.35 0.4 0.5 for Cellphones LitKiwi 54 meters / 5 ftHIGH PERFORMANCE: Tin mesh solder template is precisely positioned for fast tin implantation, and the ball template will not change under high temperature. FOUR PITCHES: Universal BGA reballing stencils have three types of holes with 0. 3 0. 35 0. 4 0. 5 pitch, four kinds of spacing and multiple sizes. WIDE APPLICATIONS: Universal BGA reballing stencils are versatile and suitable for the common IC used in cell phones today, which can meet your various