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Semiconductor devices. Mechanical and climatic test methods - Flammability of plastic-encapsulated devices (externally induced) Ingestion-build-221493 legislation and recommendations from other

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Description

legislation and recommendations from other bodies involved in the installation and maintenance of IT accommodation

BS IEC 61010-3 on the protocol for the preparation of conformity verification reports is useful for:

the land pattern dimensions normally have to be modified

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Semiconductor devices. Mechanical and climatic test methods - Flammability of plastic-encapsulated devices (externally induced) Ingestion-build-221493 legislation and recommendations from other1 Scope and object This part of IEC 60749 is applicable to semiconductor devices (discrete devices and integrated circuits). The object of this test is to determine whether the device ignites due to external heating. The test uses a needle flame, simulating the effect of small flames which may result from fault conditions within equipment containing the device. NOTE This test is identical to the test method contained in 1. 2 of chapter 4 of IEC 60749

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