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This document provides standards for implementing and collecting SEMI E10 state changes at the equipment level per SEMI E10
Subordinate Standard (included)
SEMI G13-81 (first published)
To facilitate
G05400 - SEMI G54 - Specification for Dimensions and Tolerances Used to Manufacture Molded Plastic Packages Revision:Default Title This document provides standards forThis document is a guideline for ordering the tooling required to manufacture plastic semiconductor packages. These packages include the following JEDEC registered outlines: Plastic Dual in Line Packages (PDIP); Plastic Leaded Chip Carrier (PLCC); Plastic Quad Flat Packages (PQFP); Small Outline I. C. Packages (SOIC Gull Wing and "J" lead); and Plastic TAB Quad Packages (PTAB)Title. Referenced SEMI Standards SEMI G48 Specification, Measurement Method
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